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- Lianchao Sun
- Angstrom Sun Technologies Inc.,
- Ping Hou
- Nortel Networks
- Presented at 3rd International Conference on Spectroscopic
Ellipsometry (ICSE03) in Vienna, Austria
- July 8, 2003
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- Titanium oxide (TiO2) thin film has been widely used as optical coatings
due to its high index of refraction, generally when high-low index
contrast is desired in multiple layer interference coatings. However,
structure and properties of TiO2 films are highly dependent on
processing technique and conditions. In optical MEMS structure such as
tunable vertical surface emission laser (VCSEL), TiO2 is preferred to be
prepared with e-beam evaporation because of need to control stress
within such a structure. Although e-beam evaporation has long been used
to deposit optical thin films, it is still a challenge to deposit
homogeneous TiO2 films because there are three different phases such as
amorphous, anatase and rutile. In addition, growth structure may also
vary from beginning to end of film and thus film density changes. This
poses challenges to processing quality control and thus film
characterization too.
- Spectroscopic ellipsometry is a nondestructive optical technique. It
could be used to extract thickness, roughness and optical constants
through proper optical model. At the same time, it is possible to
further extract structure information from the relationship between
optical properties and film microstructure. In this study, more
extensive examination was performed in order to provide fundamental
understanding of TiO2 film growth with the use of UV-Vis-Near IR
ellipsometry analysis. The established optical model will be verified
with destructive technique such as scanning electron microscope (SEM)
and transmission electron microscope (TEM).
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- 1. TiO2 Film Deposition
- Technique: Ion-Assisted E-beam
evaporation
- Source Material: Premelted Solid
Block from Ti2O3 Tablets
- Deposition rate: 2Å/sec
controlled by quartz crystal
- Total chamber pressure: 2.5x10-4
torr
- Oxygen partial pressure:
0.6-1.0x10-4 torr
- Initial Chamber temperature:
160oC (monitored at near sample holder)
- Substrate: 2” single side
polished Silicon wafer rotated at a speed of 32 rpm during deposition
- 2. Film Characterization
- Ellipsometry Measurement
- UV-Vis-Nir Variable Angles
Spectroscopic Ellipsometer
- Measured wavelength range:
210nm to 2000nm
- Angle of incidence used: 65,
70 and 75 Degree
- Measurement points: 120pts at
each AOI
- Microstructure
- Hitachi Scanning Electronic
Microscope (SEM)
- Transmission Electronic
Microscope (TEM)
- Atomic Force Microscope (AFM)
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- Spectroscopic ellipsometry has been successfully used to characterize
the structural inhomogeneity of TiO2 films.
- Three sub-layer model need to be used in SE analysis to describe the
inhomogeneity of the as-deposited TiO2 films. In such model,
top layer is defined as surface roughness with EMA. Both middle and
bottom layers are defined with Forouhi Interband transition plus one
absorption band in UV-Vis range.
- Three sublayer model was confirmed by SEM and AFM observation, which
corresponds to rough surface, columnar growth structure and dense part
at film bottom.
- It is found that such structural inhomogeneity is related to the chamber
temperature changes during the deposition.
- With TEM analysis, film grown at early stage mainly consists of
amorphous structure which is dense and has higher index. While it grown
in columnar structure at higher deposition temperature which contains
partial crystalline phase with relatively lower index.
- Further annealing at 250oC will increase surface roughness
due to crystallization of the film.
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- info@angstec.com
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