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- Richard Sun
- Angstrom Sun Technologies Inc.
- Ping Hou
- Nortel Networks
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- Oxides such as Silicon dioxide, Titanium dioxide and Tantalum oxide
have been widely used as interference coatings. In an optical MEMS
structure, such as a tunable vertical surface emission laser, the
wavelength is tuned through changing the cavity length between the top
and bottom mirrors, which are using TiO2 and SiO2
multi-stacks typically. Due to the multi-structure nature of a MEMS
device, the stress of thin film layers should be carefully controlled so
that they can function properly as well as to be compatible to other
adjacent configurations inside the device. In addition, the reliability
of a MEMS devoice strongly depends on the stability of its
substructures. Therefore, the evaluation of as-deposited films becomes
very crucial. In this paper, the annealing effects at 150 °C and 250 °C to the TiO2 and SiO2
films on the film properties will be studied. In specific, film
thickness, optical properties and film stress results will be reported
here.
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- 1. Film Deposition
- Technique: Ion-Assisted E-beam
evaporation
- Source Material: Pre-melted
Solid Block from Ti2O3 Tablets for TiO2 and SiO2 disc for SiO2
- Deposition rate: 2Å/sec for TiO2
and 3 Å/sec for SiO2, controlled by quartz crystal
- Total chamber pressure: 2.5x10-4
torr
- Oxygen partial pressure:
0.6-1.0x10-4 torr
- Initial Chamber temperature:
150oC (monitored at near sample holder)
- Substrate: 2” single side
polished Silicon wafer rotated at a speed of 32 rpm during deposition
- Annealing was conducted in an oven with temperature control precision ± 1o under
atmospheric environment
- 2. Film Characterization
- Ellipsometry Measurement
- UV-Vis-NIR Variable Angles
Spectroscopic Ellipsometer
- Measured wavelength range:
210nm to 2000nm
- Angle of incidence used: 65,
70 and 75 Degree
- Measurement points: 120pts at
each AOI
- Stress
- Curvature was measured with
FSM 128 system and stress was calculated with Stoney’s Equation
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- In this paper, the atmospheric evolution of TiO2 and SiO2
thin films for optical MEMS devices were studied. These films were
prepared with ion-assisted e-beam evaporation. It is found that
as-deposited SiO2 films exhibit compressive stress; whereas,
TiO2 film is in tensile under present processing conditions.
When annealed at 150 oC, both SiO2 and TiO2
films show little change of stress with annealing time. However,
increasing the annealing temperature to 250 oC caused an
obvious change of film stresses with time, in which SiO2 film
turns into less compressive and TiO2 film appears to be more
tensile. It is believed that the refractive index decrease for SiO2
film is due to further oxidation. But, for the TiO2 film,
phase transformation which could cause film to densify at 250oC
may be a main reason to the increase in tensile stress after annealing.
In addition, most significant changes in the film properties take place
in the early stage of annealing, therefore, it could be beneficial from
this finding that stability or reliability could be improved through
applying such a short period annealing on the film.
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