MSP500 Microspectrophotometer and Film Thickness Measurement System

• Features

• System Configurations

• Specifications

• Options

• Applications                                                        

• Application Examples

· Easy to operate with Window based software

· Advanced optics and rugged design for highest uptime and the best system performance

· Array based detector system to ensure fast measurement

· Affordable, portable and small footprint table top design

· Measure film thickness and Refractive Index up to 5 layers over micron size region

· Allow to acquire reflection, transmission and absorption spectra in milliseconds 

· Capable to be used for real time spectra, thickness, refractive index monitoring

· System comes with comprehensive optical constants database and library

· Advanced Software allows user to use either NK table, dispersion or composite model (EMA) for each individual film

· Integrated Vision, spectrum, simulation, film thickness measurement system

· Apply to many different type of substrates with different thickness up to 200mm size

· 2D and 3D output graphics and user friendly data management interface

· Advanced Imaging software for dimension measurement such as angle, distance, area, particle counting and more

· Various options available to meet special applications

· Model: MSP500RTMF

· Dual Detector System: CCD Array with 2048  pixels for UV-Vis and InGaAs Arrary for NIR

· Light Source: High Power DUV and Visible

· Stage: Black Anodized Aluminum Alloy with motorized travel distance 100mm by 75mm

· Focus: Motorized Auto focus with Joystick control.

· Long Working Distance Objectives: 4x, 10x, 15x, 50x (one DUV objective included)

· Communication: USB

· Software: TFProbe 2.2VM with Fully automatic Mapping Capability and 2D/3D graphics outputs

· Measurement Type: Reflection/Transmission spectra, Film thickness/refractive index, fluorescence and feature dimensions

· Computer:  Intel Core 2 Duo Processor with 200GB Hard drive and DVD+RW Burner plus 19” LCD Monitor

· Power: 110– 240 VAC /50-60Hz, 3 A

· Dimension: 16’x16’x18’ (Table top setup)

· Weight: 120 lbs total

· Warranty: One year labor and parts

· Wavelength range: 250 to 1700 nm

· Wavelength Resolution: 1nm for UV-Vis and 5 nm for NIR

· Spot Size: 100µm (4x), 40µm (10x), 30µm (15x), 8µm (50x)

· Substrate Size: up to 20mm thick

· Measurable thickness range^*: 2 nm to 50 µm

· Measurement Time: 2 ms minimum

· Accuracy^*: better than 0.5% (comparing with ellipsometry results for Thermal Oxide sample by using the same optical constants)

· Repeatability^*: < 2 Ǻ (1 sigma from 50 thickness readings for 1500 Ǻ Thermal SiO2 on Si Wafer)

· Wavelength extension to Further DUV or longer NIR range (~2500nm)

· Higher power optics for smaller spot size

· Customized configuration for special applications

· Heating and Cooling Stage for dynamic study

· Optional stage size holding samples up to 300mm

· Higher wavelength range resolution down to 0.1nm

· Various filters for special applications

· Add-on accessories for fluorescence measurement

· Add-on accessories for Raman applications

· Add-on accessories for polarizing applications

· Automatic Mapping Stage up to 300mm wafer

· Semiconductor fabrication (PR, Oxide, Nitride..)

· Liquid crystal display (ITO, PR, Cell gap…..)

· Forensics, Biological films and materials

· Inks, Mineralogy, Pigments, Toners

· Pharmaceuticals, Medial Devices

· Optical coatings, TiO₂, SiO₂, Ta₂O₅…..

· Semiconductor compounds

· Functional films in MEMS/MOEMS

· Amorphous, nano and crystalline Si

1. Measured Transmission Spectra for Color Pixels

2. Measured Film Thickness of TiO2 on Silicon

3. Measured Reflection Spectra over a MEMS Device Inside/Outside a Via-hole

4. Digital Imaging Function in MSP300 System

1. System configuration and Specifications subject to change without notice

2. * Film property, surface quality and layer stack dependent

3. Customized system available for special applications

4. TFProbe is registered trademark of Angstrom Sun Technologies Inc.