Spectroscopic Ellipsometer SE200BA-MSP Film Thickness Measurement System

       ·  Features

       ·  System Configurations

       ·  Specifications

       ·  Options

       ·  Applications

       ·  More Information

· Easy to set up

· Easy to operate with Window based software

· Advanced optics design for best system performance

·      Automatically change incident angles at 0.01 degree resolution

·     High Power DUV-VIS light source for broad band applications

· Array based detector system to ensure fast measurement

· Measure film thickness and Refractive Index up to 12 layers

· Capable to be used for real time or in-line thickness, refractive index monitoring

· System comes with comprehensive optical constants database and library

· Advanced TFProbe 3.0 Software allows user to use either NK table, dispersion or effective media approximation (EMA) for each individual film.

·     Three different user level control: Engineer mode, system service mode and easy user mode

·     Flexible engineer mode for various recipe setup and optical model testing

·     Robust one click button (Turn-key) solution for quick and routine measurement

·     Configurable measurement parameters, user preference and easiness of operation

·     Fully automatic calibration and initialization for system

·     Precise sample alignment interface from sample signal directly, no external optics needed

·     Precise height and tilting adjustment

· Apply to many different type of substrates with different thickness

· Various options, accessories available for special configurations such as mapping stage, wavelength extension, focus spot etc.

· 2D and 3D output graphics and user friendly data management interface

· Digital Imaging Tool for Micron region selection

· Integrated Reflectometer for Reflection measurement over small region

· Model: SE200BA-MSP-M300

· Detector: Detector Array

· Light Source: High Power DUV-Vis-NIR Combined Light Source

· Incident Angle Change: Automatic with Program setting

· Stage: Automatic Mapping with Rho-Theta configuration

· Software: TFProbe 3.2

· Combined SE and MSP

· Computer: Intel Duo Core Processor

· Monitor 19" Wide Screen LCD

· Power: 110– 240 VAC /50-60Hz, 6 A

· Warranty: One year labor and parts

· Wavelength range: 250 to 1000 nm

· Wavelength resolution: 1 nm

· Spot Size: 1 to 5 mm variable

· Incident Angle Range: 10 to 90 degree

· Incident Angle Change Resolution: 0.01 degree

· Digital Imaging: 1.3 MegPixels

· Effective Magnification: 1200x

· Long Work distance objective (12mm)

· MSP Beam Size: Variable 2 - 500 um

· Sample Size: up to 300 mm in diameter

· Substrate Size: up to 20mm thick

· Measurable thickness range^*: 0 nm to 10 µm

· Measurement Time: ~ 1s/Site

· Accuracy^*: better than 0.25%

· Repeatability^*: < 1 Ǻ (1 sigma from 50 thickness readings for 1500 Ǻ Thermal SiO2 on Si Wafer)

· Photometry measurement for Reflection at Non normal incident angle

· Transmission Measurement Module

· High resolution digital camera

· Ultra Long work distance objective for MSP

· Mapping X-Y Stage (X-Y mode, instead of Rho-Theta mode)

· Heating /Cooling Stage

· Vertical Sample Mounting Goniometer

· Wavelength extension to further DUV or IR range

· Scanning Monochromator Setup

· Semiconductor fabrication (PR, Oxide, Nitride..)

· Liquid crystal display (ITO, PR, Cell gap…..)

· Forensics, Biological films and materials

· Inks, Mineralogy, Pigments, Toners

· Pharmaceuticals, Medial Devices

· Optical coatings, TiO₂, SiO₂, Ta₂O₅…..

· Semiconductor compounds

· Functional films in MEMS/MOEMS

· Amorphous, nano and crystalline Si

Please contact us for more information.

1. System configuration and Specifications subject to change without notice

2. * Film property, surface quality and layer stack dependent

3. Customized system available for special applications

4. TFProbe is registered trademark of Angstrom Sun Technologies Inc.