TFProbe Wafer Measurement Tools

Angstrom Sun Technologies Inc offers optical measurement and inspection systems for semiconductor and related industries. Its core products include wafer measurement systems, spectroscopic ellipsometers, thin film reflectometers, and microspectrophotometers.

TFProbe wafer measurement systems, TFProbe WM series, measure wafer thickness, warp, bow, flatness, step/bump height, trench depth. TFProbe WM systems are based on confocal optical method with advantages of non-contact, non-destructive, long working distance, fast data acquisition, full mapping functions. Particularly, with integration with our thin film measurement technique, a total solution for thickness measurement covers from a few angstroms to several millimeters.  Another key feature is that all our tools are upgradable in future.

TFProbe Wafer TTV measurement Setup